Light emitting device and lighting system having the same

ABSTRACT

Disclosed are a light emitting device and a lighting system having the same. The light emitting device includes a body including first and second lateral side parts, third and fourth lateral side parts, and a cavity, a first lead frame extending in a direction of the first lateral side part of the body, a second lead frame extending in a direction of the second lateral side part of the body, a gap part between the first and second lead frames, and a molding member in the cavity. The first lead frame includes a first recess part having a first depth, and a second recess part recessed at a second depth in a region adjacent to the first lateral side part of the body, and the first depth of the first recess part is different from the second depth of the second recess part.

The present application claims priority under 35 U.S.C. §119(a) ofKorean Patent Application No. 10-2012-0101821 filed on Sep. 13, 2012,which is hereby incorporated by reference in its entirety.

BACKGROUND

The embodiment relates to a light emitting device and a lighting systemhaving the same.

Light emitting devices, for example, light emitting diodes (LEDs) aresemiconductor devices that convert electric energy into light andextensively used as next-generation light sources in place ofconventional fluorescent lamps and glow lamps.

Since the LED generates the light by using the semiconductor device, theLED may represent low power consumption as compared with the glow lampthat generates the light by heating tungsten or the fluorescent lampthat generates the light by urging ultraviolet ray, which is generatedthrough the high-voltage discharge, to collide with a phosphor.

In addition, the LED generates the light by using the potential gap ofthe semiconductor device, so the LED is advantageous as compared withconventional light sources in terms of life span, responsecharacteristics and environmental-friendly requirement.

In this regard, various studies have been performed to replace theconventional light sources with the LEDs. The LEDs are increasingly usedas light sources for lighting devices, such as various lamps usedindoors and outdoors, liquid crystal displays, electric signboards, andstreet lamps.

SUMMARY

The embodiment provides a light emitting device having a novel leadframe structure.

The embodiment provides a light emitting device which includes a lightemitting chip having a large size and can enhance the coupling the lowerportion of a body and lead frame due to the step structures of the leadframe.

The embodiment provides a light emitting device capable of maximizingthe lower portion area of the gap part between the first and second leadframes.

The embodiment provides a light emitting device including at least onelead frame recessed in directions opposite to each other from bothlateral sides and having recessed depths different from each other.

The embodiment provides a light emitting device including a first leadframe having different recess depths and a light emitting chip providedon the first lead frame.

The embodiment provides a light emitting device in which the depth of afirst recess part recessed from the gap part between first and secondlead frames in the direction of the first lead frame is two times deeperthan the depth of a second recess part recessed toward in another sidedirection of the first lead frame.

The embodiment provides a light emitting device in which the width ofthe first recess part of the first lead frame is equal to the width ofthe first lead frame.

The embodiment provides a light emitting device having a novel cavitystructure.

The embodiment provides a light emitting device in which the width ofthe first inner surface of the cavity is different from the width of thesecond inner surface corresponding to the first inner surface.

The embodiment provides a light emitting device including a cavityhaving inner surfaces, internal angles of which are obtuse angles.

The embodiment provides a light emitting device in which the lightemitting chip is closer to the first inner surface having a width widerthan that of the second inner surface of the cavity.

The embodiment provides a light emitting device having the lightemitting chip in the cavity and a protective chip provided in the body.

The embodiment provides a light emitting device having two pairs ofinner surfaces corresponding to each other and a pair of inner surfacesthat do not correspond to each other in the cavity.

According to the embodiment, there is provided a light emitting deviceincluding a body including first and second lateral side partscorresponding to each other, third and fourth lateral side partscorresponding to each other, and a cavity having an open upper portion,a first lead frame disposed on a bottom surface of the cavity whileextending in a direction of the first lateral side part of the body, asecond lead frame disposed on the bottom surface of the cavity whileextending in a direction of the second lateral side part of the body, agap part disposed between the first and second lead frames, and amolding member in the cavity. The first lead frame includes a firstrecess part recessed at a first depth in the direction of the firstlateral side part of the body from the gap part, and a second recesspart recessed at a second depth in a region adjacent to the firstlateral side part of the body, and the first depth of the first recesspart is different from the second depth of the second recess part.

According to the embodiment, there is provided a light emitting deviceincluding a body including first and second lateral side partscorresponding to each other, third and fourth lateral side partscorresponding to each other, and a cavity having an open upper portion,a first lead frame disposed on a bottom surface of the cavity whileextending in a direction of the first lateral side part of the body, asecond lead frame disposed on the bottom surface of the cavity whileextending in a direction of the second lateral side part of the body, agap part disposed between the first and second lead frames, and amolding member in the cavity. The first lead frame includes a firstrecess part recessed at a first depth in the direction of the firstlateral side part of the body from the gap part, and a second recesspart recessed at a second depth in a region adjacent to the firstlateral side part of the body, and the first depth of the first recesspart is different from the second depth of the second recess part. Thecavity includes a first inner surface adjacent to the light emittingchip and a second inner surface which is spaced apart from the lightemitting chip by an interval greater than an interval between the firstinner surface and the light emitting chip and disposed in opposition tothe first inner surface, and the second inner surface has a widthnarrower than a width of the first inner surface and a width of at leastone lateral side of the light emitting chip.

According to the embodiment, there is provided a light emitting deviceincluding a body including first and second lateral side partscorresponding to each other, third and fourth lateral side partscorresponding to each other, and a cavity having an open upper portion,a first lead frame disposed on a bottom surface of the cavity whileextending in a direction of the first lateral side part of the body, asecond lead frame disposed on the bottom surface of the cavity whileextending in a direction of the second lateral side part of the body, agap part disposed between the first and second lead frames, and amolding member in the cavity. The cavity includes a first inner surfaceadjacent to the light emitting chip and a second inner surface which isspaced apart from the light emitting chip by an interval greater than aninterval between the first inner surface and the light emitting chip anddisposed corresponding to the first inner surface, and the first innersurface of the cavity has a width different from a width of the secondinner surface of the cavity.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a light emitting device accordingto a first embodiment;

FIG. 2 is a plan view showing the light emitting device of FIG. 1;

FIG. 3 is an enlarged view showing a portion of the light emittingdevice of FIG. 1;

FIG. 4 is a sectional view taken along line Y-Y of the light emittingdevice of FIG. 2

FIG. 5 is a sectional view taken along line X-X of the light emittingdevice of FIG. 2;

FIGS. 6 to 9 are sectional views showing a lateral side of the body ofthe light emitting device of FIG. 2;

FIG. 10 is a bottom view showing the light emitting device of FIG. 2,

FIGS. 11 and 12 are a front view and a bottom view showing the leadframe of the light emitting device of FIG. 2;

FIGS. 13 and 14 are a plan view and a bottom view showing other examplesof the lead frames in the light emitting device shown in FIGS. 11 and12;

FIG. 15 is a plan view showing a light emitting device according to thesecond embodiment;

FIG. 16 is a plan view showing the modification of the light emittingdevice of FIG. 15;

FIG. 17 is a plan view showing the modification of the light emittingdevice of FIG. 15;

FIG. 18 is a plan view showing a light emitting device according to thethird embodiment;

FIG. 19 is a plan view showing a light emitting device according to thefourth embodiment;

FIG. 20 is a side sectional view showing a light emitting deviceaccording to the fifth embodiment;

FIG. 21 is a side sectional view showing a light emitting deviceaccording to the sixth embodiment;

FIG. 22 is a side sectional view showing a light emitting deviceaccording to the seventh embodiment;

FIG. 23 is a side sectional view showing a light emitting deviceaccording to the eighth embodiment;

FIGS. 24 to 26 are views showing the light emitting device according tothe ninth embodiment;

FIGS. 27 to 28 are graphs the comparison in the distribution of theorientation angle of the light emitting device according to theembodiment;

FIG. 29 is a sectional view showing one example of a light emitting chipin a light emitting device according to the embodiment;

FIG. 30 is a sectional view showing another example of a light emittingchip in a light emitting device according to the embodiment;

FIG. 31 is a perspective view showing a display apparatus having thelight emitting device according to the embodiment.

FIG. 32 is a sectional view showing a display apparatus according to theembodiment; and

FIG. 33 is an exploded perspective view showing a lighting device havingthe light emitting device according to the embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following description, when a predetermined part “includes” apredetermined component, the predetermined part does not exclude othercomponents, but may further include other components unless otherwiseindicated. In the description of the embodiments, it will be understoodthat when a substrate, a frame, a sheet, a layer, or a pattern isreferred to as being “on” another substrate, another frame, anothersheet, another layer, or another pattern, it can be “directly” or“indirectly” on the other substrate, the other frame, the other sheet,the other layer, or the other pattern may also be present. In contrast,when a part is referred to as being “directly on” another part, theintervening layer is not present.

Hereinafter, embodiments will be clearly comprehended by those skilledin the art with reference to accompanying drawings and the descriptionof the embodiments. The thickness and size of each layer shown in thedrawings may be exaggerated, omitted or schematically drawn for thepurpose of convenience or clarity. In addition, the size of elementsdoes not utterly reflect an actual size. The same reference numbers willbe assigned the same elements throughout the drawings.

Hereinafter, a light emitting device according to the embodiment will bedescribed with reference to accompanying drawings.

FIG. 1 is a perspective view showing a light emitting device accordingto a first embodiment, FIG. 2 is a plan view showing the light emittingdevice of FIG. 1, and FIG. 3 is an enlarged view showing a portion ofthe light emitting device of FIG. 2. FIG. 4 is a sectional view takenalong line Y-Y of the light emitting device of FIG. 1, FIG. 5 is asectional view taken along line X-X of the light emitting device of FIG.1, and FIGS. 6 to 9 are sectional views showing a lateral side of thebody of the light emitting device of FIG. 2. FIG. 10 is a bottom viewshowing the light emitting device of FIG. 2, and FIGS. 11 and 12 are afront view and a bottom view showing a lead frame of the light emittingdevice of FIG. 2.

Referring to FIGS. 1 to 5, a light emitting device 100 includes a body111 having a cavity 101, a plurality of lead frames 121 and 131, a lightemitting chip 171, a wire 175, and a molding member 161.

The body 111 may include an insulating material or a conductivematerial. The body 111 may include at least one of a resin material suchas polyphthalamide (PPA) or polycyclohexylene terephthalate (PCT),silicon (Si), a metallic material, photo sensitive glass (PSG), sapphire(Al₂O₃), and a printed circuit board (PCB). For example, the body 111may be injection-molded through an injection scheme. The body 111 mayinclude a resin material such as epoxy or silicon.

The body 111 includes an epoxy molding compound (EMC) material havingepoxy, and the EMC material represents improved formability, improvedmoisture resistance, and an improved adhesive property, and includes aninsulating material. The body 111 may have a filler, which includes ametallic oxide such as TiO₂, SiO₂, in order to enhance a reflectionefficiency. The filler having the contents of 10 wt % or more, forexample, 15 wt % or more may be contained in the body 111.

The body 111 may include a reflective material for light reflection, ormay include a transmissive material to broad the distribution of lightorientation angles, but the embodiment is not limited thereto.

The outer shape of the body 111 may have a polygonal structure such as arectangular shape or a square shape when viewed from the top. The outercorners of the body 111 may be angulated or curved.

In the light emitting device 100, if the body 111 has the square shape,the body 111 may include a plurality of lateral side parts, for example,four lateral side parts 61 to 64. At least one of the lateral side parts61 to 64 may be perpendicular to the bottom surface of the body 111 ormay be inclined with respect to the bottom surface of the body 111.Hereinafter, the body 111 having the first to fourth lateral side parts61 to 64 will be described for the illustrative purpose. The firstlateral side part 61 and the second lateral side part 62 are opposite toeach other. The second lateral side part 63 and the fourth lateral sidepart 64 are opposite to each other. An axis passing through the centerof the first and second lateral side parts 61 and 62 of the body 111 isdefined as a first axis Y-Y, and an axis passing through the third andfourth lateral side parts 63 and 64 of the body 111 is defined as asecond axis X-X. The first axis Y-Y may be perpendicular to the secondaxis X-X. The first axis Y-Y of the light emitting device 100 representsa lengthwise direction of the body 111, and the second axis X-X mayrepresent a widthwise direction.

In the body 111, a length Y1 of the third lateral side part 63 or thefourth lateral side part 64 may be equal to or longer than a width X1 ofthe first lateral side part 61 or the second lateral side part 62. Ifthe length Y1 of the third lateral side part 63 or the fourth lateralside part 64 is longer than the width X1 of the first lateral side part61 or the second lateral side part 62, the length Y1 of the thirdlateral side part 63 or the fourth lateral side part 64 may be 1.2 timeslonger than the width X1 of the first lateral side part 61 or the secondlateral side part 62.

The body 111 includes the cavity 101 having an open upper portion and apredetermined depth, and the cavity 101 may have a cup structure or arecess structure having a depth lower than that of the top surface ofthe body 111. The lead frames 121 and 131 and a gap part 115 may bedisposed on a bottom surface of the cavity 101, and the gap part 115 maybe interposed between the lead frames 121 and 131.

The cavity 101 may include a plurality of inner surfaces 11 to 16. Thecavity 101 may have more than four inner surfaces 11 to 16, for example,five or six inner surfaces. Hereinafter, an example that the cavity 101according to the embodiment has six inner surfaces 11 to 16 will bedescribed. At least one of the first to six inner surfaces 11 to 16 mayhave a curved surface or may be connected to a curved surface in apredetermined section.

At least one of the inner surfaces 11 to 16 is inclined outward withrespect to a thickness direction Z0 or an optical axis of the lightemitting chip 171. For example, the at least one of the inner surfaces11 to 16 may be inclined with respect to the top surface of the leadframes 121 and 131 or the horizontal bottom surface of the cavity 101.Although the embodiment has been described in that the inner surfaces 11to 16 of the cavity 101 are inclined, but the embodiment is not limited.For example, at least one of the inner surfaces 11 to 16 of the cavity101 may be perpendicular to the top surface of the lead frames 121 and131 or the horizontal bottom surface of the cavity 101, but theembodiment is not limited thereto.

Referring to FIGS. 2 and 3, the sum of the internal angles of the innersurfaces 11 to 16 is 400° or more. In addition, in two adjacent innersurfaces, boundary regions where the internal angle is formed as anobtuse angle may be two or more of boundary regions, for example, fourof boundary regions.

The inner surfaces 11 to 16 of the cavity 101 may be defined as first tosixth inner surfaces 11 to 16. The first inner surface 11 corresponds toa first lateral side part 61 of the body 111, and the second innersurface 12 corresponds to the second lateral side part 62 of the body111. The third inner surface 13 corresponds to the third lateral sidepart 63 of the body 111, and the fourth inner surface 14 corresponds tothe fourth lateral side part 64 of the body 111. The fifth inner surface15 is connected between the third and second inner surfaces 13 and 12,and forms an obtuse angle together with at least one of the third andsecond inner surfaces 13 and 12. The sixth inner surface 16 is connectedbetween the fourth inner surface 14 and the second inner surface 12, andforms an obtuse angle together with at least one of the fourth andsecond inner surfaces 14 and 12.

The first to fourth inner surfaces 11 to 14 may correspond to the innersurfaces of the light emitting chip 171.

The internal angle θ2 between the fifth and third inner surfaces 15 and13 may be formed as an obtuse angle, for example, an angle of 130° to170°. In addition, the internal angle between the sixth and fourth innersurfaces 16 and 14 may be formed within the range of the angle θ2, ormay be equal to the angle θ2.

The internal angle θ3 between the fifth and second inner surfaces 15 and12 may be formed as an obtuse angle, for example, an angle of 140° to165°. In addition, the internal angle between the sixth and second innersurfaces 16 and 12 may be formed within the range of the angle θ3, ormay be equal to the angle θ3. In addition, the fifth inner surface 15may be formed at an angle θ1 less than 90°, for example, an angle of 10°to 50° about a line segment extending from the third inner surface 13.

In addition, the first and second inner surfaces 11 and 12 are parallelto each other, and the third and fourth inner surfaces 13 and 14 areparallel to each other. The sixth and second inner surfaces 16 and 12are formed perpendicularly to each other. The fifth and sixth innersurfaces 15 and 16 are obliquely formed with respect to the first tofourth inner surfaces 11 to 14 in such a manner that the fifth and sixthinner surfaces 15 and 16 are not parallel to the first to fourth innersurfaces 11 to 14. The corners of the first to sixth inner surfaces 11to 16 may be curved or angulated, but the embodiment is not limitedthereto.

A second width D2 of the second inner surface 12 of the cavity 101 maybe narrower than a first width D1 of the first inner surface 11. Thesecond width D2 may be at least 1.5 times narrower than the first widthD1, for example, may be 2.5 times to 3.5 times narrower than the firstwidth D1. The second width D2 may be less than a width X3 of the lightemitting chip 171, and may be 1/3.5 times less than a width X1 of thebody 111. The first width D1 may be 1.2 times greater than the width X3of the light emitting chip 171. The second width D2 may be in the rangeof 0.42 mm±0.05 mm, and may be changed according to the sizes of thelight emitting chip 171. The first and second widths D1 and D2 may belengths of the boundary regions in which the first and second innersurfaces 11 and 12 make contact with the top surface of the body 111.

The second width D2 is at least 1.5 times narrower than the first widthD1, for example, 2.5 times to 3.5 times narrower than the first widthD1, in such a manner that a cavity structure representing an asymmetricstructure with respect to one axial direction is provided. A protectivechip 173 is disposed in the body 111, thereby more preventing the lightloss as compared with that of the structure in which the protective chip173 is disposed in the cavity 101.

The difference between the second and first widths D2 and D1 may be madeby taking the size of the protective chip 173 and a bonding region ofthe wire 175 of the second lead frame 131. For example, if one wire 175is provided, the difference between the second and first widths D2 andD1 may be more increased, but the embodiment is not limited thereto.

In addition, the cavity having a symmetric structure with respect toanother axial direction is provided, so that the degradation of thelight extraction efficiency can be prevented. The second width D2 of thesecond inner surface 12 of the cavity 101 is formed narrower than thefirst width D1 of the first inner surface 11, so that the cavity havingfive or more inner surfaces is provided instead of the cavity havingfour inner surfaces. Accordingly, the light loss can be minimized.

The center of the first inner surface 11 is aligned in line with thecenter of the second inner surface 12 in the cavity 101. For example,the centers of the first and second inner surfaces 11 and 12 may bealigned in line with the first axis Y-Y. Alternatively, one of thecenters of the first and second inner surfaces 11 and 12 in the cavity101 may deviate from the first axis Y-Y, but the embodiment is notlimited thereto.

The maximum interval between the fifth and sixth inner surfaces 15 and16 in the cavity 101 is the interval D1 between the third and fourthinner surfaces 13 and 14, and the minimum interval between the fifth andsixth inner surfaces 15 and 16 may be equal to the width D2 of thesecond inner surface 12.

A width E1 of the fifth or sixth inner surface 15 or 16 may be less thanthe width D1 of the first inner surface 11, and wider than the width D2of the second inner surface 12. The width D1 of the first inner surface11 may be equal to or different from the width A1 of the third or fourthinner surface 13 or 14, but the embodiment is not limited thereto. Inthis case, a distance A2 may be the interval between a line horizontalto the second inner surface 12 and the inflection point between thethird and fifth inner surfaces 13 and 15, or the inflection pointbetween the fourth and sixth inner surfaces 14 and 16, and may beshorter than the width A1.

The width of a region corresponding to the space between the secondlateral side part 62 of the body 111 and the second inner surface 12 maybe narrower than the width of a region corresponding to the spacebetween the second lateral side part 62 and the first inner surface 11.

The length Y2 of the cavity 101 in the first axial direction Y-Y may begreater than the width D1 in a second axial direction X-X. In detail,the length Y2 may be 1.2 or more times, for example, 1.4 times longerthan the width D1. The cavity 101 has a substantially line-symmetricstructure with respect to the first axial direction Y-Y, and has anasymmetric structure with respect to the second axial direction X-X.

In addition, a portion of the top surface of the first lead frame 121exposed to the bottom surface of the cavity 101 may has a square shapeor a rectangular shape. A portion of the top surface of the second leadframe 131 exposed to the bottom surface of the cavity 101 may have atrapezoid shape. For example, regarding the width of the top surface ofthe second lead frame 131 exposed to the bottom surface of the cavity101, a region adjacent to the second inner surface 12 of the cavity 101may have a width narrower than that of a region corresponding to thefirst lead frame 121.

As shown in FIG. 4, the angle θ4 of the first inner surface 11 or thesecond inner surface 12 of the cavity 101 may be formed as an angle of90° or more, for example, an angle of 91° to 120° about the top surfaceof the lead frame 121 or 131 or the bottom surface of the cavity 101.The first inner surface 11 or the second inner surface 12 may have thesame angle or different angles, but the embodiment is not limitedthereto.

As shown in FIG. 5, the angle θ5 of the third inner surface 13 or thefourth inner surface 14 of the cavity 101 may be formed as an angle of90° or more, for example, an angle of 91° to 120° about the top surfaceof the lead frames 121 and 131 or the bottom surface of the cavity 101.The third inner surface 13 or the fourth inner surface 14 may have thesame angle or different angles, but the embodiment is not limitedthereto.

The first to fourth inner surfaces 11, 12, 13, and 14 may be inclined atthe same angle with respect to the top surfaces of the lead frames 121and 131, or the bottom surface of the cavity 101. For example, theangles θ4 and θ5 may be formed in the range of 91° to 97°. In addition,the fifth and sixth inner surfaces 15 and 16 of the cavity 101 may beinclined at an angle of 90° to 120° with respect to the top surface ofthe lead frames 121 and 131 or the horizontal bottom surface of thecavity 101. For example, the fifth and sixth inner surfaces 15 and 16 ofthe cavity 101 may be inclined at the same angle as that of the first tofourth inner surfaces 11 to 14.

The first inner surface 11 of the cavity 101 is adjacent to a firstlateral side S1 of the light emitting chip 171, and the second innersurface 12 is spaced apart from a second lateral side S2 of the lightemitting chip 171. The third inner surface 13 is adjacent to a thirdlateral side S3 of the light emitting chip 171, and the fourth innersurface 14 is adjacent to the fourth lateral side S4 of the lightemitting chip 171. In this case, the light emitting chip 171 may have apolygonal shape or a curved shape, but the embodiment is not limitedthereto. The light emitting chip 171 is provided in such a manner thatthe interval from the second inner surface 121 among the first to fourthinner surfaces 11 to 14 of the cavity 101 corresponding to the lateralsides S1 to S4 is two times greater than the intervals from the first tothird inner surfaces 11 to 13.

As shown in FIGS. 4 and 5, the body 111 includes a support body 112disposed under the top surface of the lead frames 121 and 131, areflection body 113 disposed on the top surface of the lead frames 121and 131, and a gap part 115 interposed between the first and second leadframes 121 and 131. The support body 112, the reflection body 113, andthe gap part 115 may be connected to each other. The reflection body 113may have a thickness thicker than that of the support body 112. Forexample, the reflection body 113 may have a thickness of 150 μm or more.The reflection body 113 may have a thickness T3 corresponding to 50% ormore of the thickness T1 of the body 111.

The interval F1 between the first lateral side part 61 of the topsurface of the body 111 and the first inner surface 11 of the cavity 101may be narrower than the interval F2 between the second lateral sidepart 62 of the top surface of the body 111 and the second inner surface12 of the cavity 101. The interval F2 is wider than the interval F1, sothat the second lead frame 131 may be supported. The thickness T2 of thelead frames 121 and 131 may be equal to the thickness of the supportbody 112.

Referring to FIG. 2, and FIGS. 6 to 13, in the structure of the leadframes, the inner region of the first lead frame 121 is disposed at thebottom surface of the cavity 101, and the outer region of the first leadframe 121 extends to lower portions of the first, third, fourth innersurfaces 11, 13, and 14 of the cavity 101. As shown in FIGS. 4 and 5,the first lead frame 121 includes at least one first protrusion 126exposed to the first lateral side part 61 of the body 111, a secondprotrusion 127 exposed to the third lateral side part 63, and the thirdprotrusion 128 exposed to the fourth lateral side part 64. The first tothird protrusions 126 to 128 are spaced apart from the bottom surface117 of the body 111 by a predetermined interval G1. The interval G1 maybe 10 μm or more, or ½ or less of the thickness T2 of the first leadframe 121.

The inner region of the second lead frame 131 is disposed at the bottomsurface of the cavity 101, and the outer region of the second lead frame131 extends to the lower portions of the second, fifth, and sixth innersurfaces 12, 15, and 16. The second lead frame 131 includes at least onefourth protrusion 136 exposed to the second lateral side part 62 of thebody 111, a fifth protrusion 137 exposed to the third lateral side part63, and a sixth protrusion 138 exposed to the fourth lateral side part64.

Referring to FIGS. 11 and 12, the first protrusion 126 of the first leadframe 121 and the fourth protrusion 136 of the second lead frame 131 mayprotrude in the plural. The second and third protrusions 127 and 128 ofthe first lead frame 121 protrude in opposition to each other, and thefifth and sixth protrusions 137 and 138 of the second lead frame 131protrude in opposition to each other. The corner part of the first andsecond lead frames 121 and 131 may be angulated or curved.

As shown in FIGS. 6 to 9, the fourth to sixth protrusions 136, 137, and138 are spaced apart from the bottom surface 117 of the body 111 by apredetermined interval G1. The interval G1 may be 10 μm or more, orwhich may be 50% or less of the thickness T2 of the second lead frame131.

As shown in FIGS. 4, 5, and 10, the first and second lead frames 121 and131 include lead regions making contact with the top surface of theprinted circuit board PCB. A first lead region 125 of the first leadframe 121 is exposed to the bottom surface 117 of the body 111, anddisposed between the first and second recess parts 122 and 123. Thesecond lead region 135 of the second lead frame 131 is exposed to thebottom surface 137 of the body 111, and disposed between the gap part115 and the third recess part 133.

The interval B5 between the first and second lead regions 125 and 135 iswider than the interval between the first and second lead frames 121 and131 of the bottom surface of the cavity 101. The length B2 of the firstlead region 125 may be longer than the length C2 of the second leadregion 135, but the embodiment is not limited thereto. The length B2 ofthe first lead region 125 may be in the range of 0.5 mm±0.1 mm, and thelength C2 of the second lead region 135 may be in the range of 0.4mm±0.05 mm. Since the area of the first lead region 125 is wider thanthe area of the second lead region 135, heat radiations can beeffectively occur.

In addition, the interval B5 between the first and second lead regions125 and 135 is made by taking the interval between circuit patterns ofthe substrate into consideration, so that a general-purpose lightemitting device can be provided. Accordingly, the area of the bottomsurface of the first lead frame 121 is narrower than the area of the topsurface of the first lead frame 121. In detail, the area of the bottomsurface of the first lead frame 121 is narrower than the area of the topsurface of the first lead frame 121 by 30% or more. The length B1 of thetop surface of the first lead frame 121 may be wider than the length C1of the top surface of the second lead frame 131. In detail, the lengthB1 of the top surface of the first lead frame 121 may be wider than thelength C1 of the top surface of the second lead frame 131 by 30% ormore. The difference in the length between the top surfaces of the firstand second lead frames 121 and 131 can improve heat radiation efficiencyof the light emitting chip 171.

The first and second lead frames 121 and 131 are disposed at the lowerportions thereof with a plurality of recess parts making contact with orcoupled with the support body 112 of the body 111. The recess parts maybe defined as recess regions.

For example, the first lead frame 121 includes first and second recessparts 122 and 123. The first recess part 122 is interposed between thefirst lead region 125 of the first lead frame 121 and the gap part 115,and disposed therein with the support body 112 as shown in FIG. 5. Thefirst recess part 122 has a width equal to the width X1 of the body 111or the length of the first lateral side part 61, and has a depth B4which is two times wider than the depth B3 of the second recess part123. The first recess part 122 is disposed in a step structure under theinner region of the first lead frame 121, so that the first recess part122 is coupled with the support body 112 of the body 111.

The depth B4 of the first recess part 122 has the range of 30% to 60% ofthe length B1 of the first lead frame 121, and forms a step structurewith respect to the flat surface of the first lead region 125. Theheight of the first recess part 122 is an interval from the bottomsurface 117 of the body 111, and may be 50% or less of the thickness T2of the first lead frame 121. If the interval G1 is excessively thick,the protrusions of the first lead frame 121 may be excessively thinned,so that heat radiation efficiency can be degraded, the strength can beweakened, and the coupling strength with the body 112 may be degraded.In addition, if the interval G1 is excessively thinned, the support bodyat the lower portion of the body 112 may be degraded. In addition, thedepth B4 and the width of the first recess part 122 may increase thearea of the lower portion of the gap part 115. The area of the lowerportion of the gap part 115 is increased by at last two times ascompared with the structure without the recess, so that the area betweenthe first and second lead frames 121 and 131 can be enhanced. Inaddition, the infiltration path of the moisture into the first leadframe 121 having the light emitting chip 171 mounted thereon can beincreased by two times or more.

In addition, if the light emitting chip 171 is enlarged, the size of thefirst lead frame 121 having the light emitting chip 171 mounted thereonis increased in proportion to the size of the light emitting chip 171.In addition, if the top surface of the first lead frame 121 exposed tothe cavity 101 is increased, the strength of the region between thefirst and second lead frames 121 and 131 may be more weakened.Therefore, the width of the gap part 115 is increased without decreasingthe area of the top surface of the first lead frame 121. In other words,the area of the gap part 115 is ensured by forming the first recess part121 at the lower portion of the first lead frame 121, so that strengthcan be enhanced between the first and second lead frames 121 and 131.

The first recess part 122 of the first lead frame 121 is recessed at apredetermined depth B4 from the gap part 115 to the first lateral sidepart 11 of the body 111. In the first recess part 122, the thickness T5of the upper portion of the first lead frame 121 may be in the range of30% to 70%, for example, 50% or more of the thickness T2 of the firstlead frame 121. The upper thickness T5 of the first and second leadframes 121 and 131 may be equal to the thicknesses of the second andthird protrusions 128 and 138. In addition, the depth B4 of the firstrecess part 122 may be equal to or different from the lengths of thesecond protrusion 128 and the third protrusion 138.

The second recess part 123 of the first lead frame 121 is adjacent tothe first lateral side part 61 of the body 111, has a step structurefrom the first lead region 125 under the first protrusion 126, and iscoupled with the lower portion of the body 111, that is, the supportbody 112 of the body 111. In the second recess part 123, the thicknessT5 of the upper portion of the second lead frame 131 may be in the rangeof 30% to 70%, for example, 50% or more of the thickness T2 of the firstlead frame 121. If the interval G1 is excessively thick, the thicknessof the protrusions of the second lead frame 131 is excessively thinned,so that the heat radiation efficiency can be degraded, and the strengthmay be weakened. Accordingly, the coupling strength with the body 112may be degraded. If the interval G1 is excessively thinned, the supportbody serving as the lower portion of the body 112 may be damaged.

The second lead frame 131 includes third and fourth recess parts 133 and134 having the step structure under the fourth to sixth protrusions 136,137, and 138. The third recess part 133 is a step difference region fromthe second lead region 135 of the second lead frame 131, and is coupledwith the support body 112 which is the lower portion of the body 111.The thickness T5 of the upper portion of the second lead frame 131 inthe third recess part 133 may be thinner than the thickness T2 of thesecond lead frame 131. In detail, the thickness T5 of the upper portionof the second lead frame 31 may be thinner than the thickness T2 of thesecond lead frame 131. In detail, the thickness T5 of the upper portionof the second lead frame 31 may be in the range of 30% to 70%, forexample, 50% or more of the thickness T2 of the second lead frame 131.The third recess part 133 is a region formed by etching the lower regionof the second lead frame 131. The third recess part 133 has the heightcorresponding to the interval from the bottom surface 117 of the body111, and has a thickness corresponding to 50% or less of the thicknessT2 of the second lead frame 131. The fourth recess part 134 may have thestep structure under the fifth and sixth protrusions 137 and 138.

The width or the area of the top surface of the second lead frame 131may be wider than the width or the area of the bottom surface of thesecond lead frame 131.

The depth B3 of the second recess part 123 of the first lead frame 121and the depth C3 of the third recess part 133 of the second lead frame131 may be defined as depths of outer sides of the first and second leadframes 121 and 131, and may be 0.8 μm or more, for example, in the rangeof 0.8 μm to 30 μm. The depths B3 and C3 of the second and third recessparts 123 and 133 may be the minimum thicknesses to prevent the supportbody 112 of the body 111 from being damaged.

The depth B4 of the first recess part 122 in the lower region of thefirst lead frame 121 may be at least two times longer than the depth B3of the second recess part 123. Accordingly, since the first recess part122 is spaced apart from the bottom surface of the body 111, therebyincreasing the infiltration path of moisture to the top surface of thefirst lead frame 121 having the light emitting chip 171 mounted thereon.

In addition, the bending portions of the second and third recess parts123 and 133 may be curved with a predetermined curvature, and the curvedsurfaces increase the contact area of the support body 112 and increasethe infiltration path of the moisture. In addition, the recess part 122may be curved with a predetermined curvature adjacent to the first leadregion 125.

The gap part 115 is disposed in the region between the first and secondlead frames 121 and 131. The gap part 115 has an interval in the bottomsurface of the body 111 two times wider than the width in the bottomsurface of the cavity 101 (see B5 of FIG. 8).

The thicknesses T2 of the first and second lead frames 121 and 131 maybe in the range of 0.15 mm to 0.8 mm, for example, in the range of about0.25 mm to about 0.35 mm. The first and second lead frames 121 and 131may include a metallic material, for example, at least one of titanium(Ti), copper (Cu), nickel (Ni), gold (Au), chrome (Cr), tantalum (Ta),platinum (Pt), zinc (Sn), silver (Ag), and phosphorous (P). The firstand second lead frames 121 and 131 may include a single metallic layeror a multi-metallic layer. The thicknesses T2 of the first and secondlead frames 121 and 131 are different from each other, but theembodiment is not limited thereto.

At least one light emitting chip 171 is disposed on the first lead frame121. An adhesive agent (not shown) may be disposed between the lightemitting chip 171 and the second lead frame 131. The light emitting chip171 may be closer to the first inner surface 11 of the cavity 101 thanthe second inner surface 12 of the cavity 101. In addition, the centerof the light emitting chip 171 may deviate from the central axis Z0 ofthe light emitting device, and may be closer to the second inner surface12 of the cavity 101 than the first inner surface 11 of the cavity 101.

The adhesive agent may include a conductive adhesive agent or aninsulating adhesive agent. According to the embodiment, the lightemitting chip 171 is bonded to the first lead frame 121 by using aconductive adhesive agent, and the first lead frame 121 is electricallyconnected to the light emitting chip 171. The light emitting chip 1271may be electrically connected to the second lead frame 131 through aconnection member such as at least one wire 175.

The light emitting chip 171 may selectively emit light in range of thevisible light band to the ultraviolet light band. For example, the lightemitting chip 171 may be selected from red, blue, green, yellow-green,and white LED chips. The light emitting chip 171 includes an LED chipincluding at least one of compound semiconductors of the group III-Velements to compound semiconductors of group II-VI elements. One lightemitting chip 171 or a plurality of light emitting chips 171 may bedisposed in the cavity 101, but the embodiment is not limited thereto.The light emitting chip 171 may include a vertical chip in whichelectrodes for an anode and a cathode are vertically arranged, a flipchip in which the electrodes for the anode and the cathode are arrangedin one direction, or a horizontal chip in which the electrodes for theanode and the cathode are horizontally arranged. The length Y3 of thelight emitting chip 171 may be in the range of 0.5 mm to 1.5 mm, and thewidth X3 of the light emitting chip 171 may be in the range of 0.5 mm to1.5 mm, but the embodiment is not limited thereto. The length and thewidth of the light emitting chip 171 may be equal to each other ordifferent from each other. The thickness of the light emitting chip 171may be in the range of 100 μm to 300 μm.

The protective chip 173 is disposed on the second lead frame 131, andconnected with the first lead frame 121 through the connection membersuch as the wire 176 or a conductive pattern. The protective chip 173 isembedded in the body 111 and disposed at an outside of the cavity 101adjacent to the fifth inner surface 15. The wire 176 connected to theprotective chip 173 is disposed in the body 111, and a portion of theprotective chip 173 may be exposed from the body 111, but the embodimentis not limited thereto.

As shown in FIG. 3, an interval A3 between the fifth inner surface 15 ofthe cavity 101 and the corner of the body 111 may be 5 mm or more, forexample, in the range of 5.82 mm to 6.59 mm. The interval A3 can providethe space for the bonding of the protective chip 173.

Alternatively, the protective chip 173 may be disposed at anotherregion. In detail, the protective chip 173 may be disposed in the body111 outside the sixth inner surface 16. In addition, a plurality ofprotective chips may be adjacent to at least one of the fifth and sixthinner surfaces 15 and 16 and may be embedded in the body 111. Theprotective chip 173 may include a thyristor, a zener diode, or atransient voltage suppression (TVS), but the embodiment is not limitedthereto.

The molding member 161 is disposed in the cavity 101. The molding member161 covers the light emitting chip 171. The molding member 161 includesa transmissive resin layer such as silicon or epoxy, and may have asingle layer structure or a multiple layer structure. In addition, themolding member 161 may include a phosphor used to convert the wavelengthof the light emitted upward from the light emitting chip 171. Thephosphor excites a portion of the light emitted from the light emittingchip 171 so that the light can be mitted with a different wavelength.The phosphor may selectively include YAG, TAG, silicate, nitride, andoxy-nitride-based materials. The phosphor may include at least one red,yellow, and green phosphors, but the embodiment is not limited thereto.The top surface of the molding member 161 may have a flat shape, aconcave shape, or a convex shape, and may serve as a light exit surface.A lens may be disposed at the upper portion of the molding member 161.The lens may include a convex lens, a concave lens, and a convex lenshaving a total reflection surface at the center thereof for the lightemitting chip 171, but the embodiment is not limited thereto.

Alternatively, a phosphor layer may be further disposed on the moldingmember 161 and the light emitting chip 171, and a molding memberrepresenting a reflective characteristic may be disposed between theinner surfaces 11 to 16 of the cavity 101 and the lateral sides of thelight emitting chip 171. The reflective material has a characteristic ofreflecting 70% of the wavelength emitted from the light emitting chip171. A molding member having transmittance may be disposed on themolding member having reflectance, but the embodiment is not limitedthereto.

FIGS. 13 and 14 show other examples of FIGS. 11 and 12, and show firstand fourth protrusions 126A and 136A of the first and second lead frames131 disposed in a single form. One protrusion or a plurality ofprotrusions protrude from the first and second lead frames 131, but theembodiment is not limited thereto.

FIG. 15 is a plan view showing a light emitting device according to theembodiment. In the following description of the second embodiment, thesame parts as those of the first embodiment will make a reference to thefirst embodiment.

Referring to FIG. 15, the light emitting device includes the body 111having the cavity 111, a plurality of lead frames 121 and 131, a lightemitting chip 171, a wire 175, and a molding member.

In the first to sixth inner surfaces 11 to 16 of the cavity 101, atleast one of corners between adjacent inner surfaces may be curved witha predetermined curvature. For example, the corners between the firstand third inner surfaces 11 and 13 and the first and fourth innersurfaces 11 and 14 have curved surface R5 and R6 with a predeterminedcurvature. The internal angle θ7 between the first and third innersurfaces 11 and 13, or between the first and fourth inner surfaces 11and 14 may be in the range of 88° to 92°. The curvatures of the curvedsurfaces R5 and R6 may be in the range of 0.05±0.01 mm. The curvaturesmay have the same value.

The corners between the third inner surface 13 and the fifth innersurface 15 of the cavity 101 and between the fourth inner surface 14 andthe sixth inner surface 16 include curved surfaces R1 and R2 with apredetermined curvature. The internal angle θ6 between virtual linesegments extending from the third and fifth inner surfaces 13 and 15 orbetween virtual line segments extending from the fourth and sixth innersurfaces 14 and 16 may be in the range of 120° to 165°. The curvaturesof the curved surfaces R1 and R2 may be in the range of 0.80±0.08 mm,and may be equal to each other.

The corners between the second inner surface 12 and the fifth innersurface 15 of the cavity 101 and between the second inner surface 12 andthe sixth inner surface 16 include curved surfaces R3 and R4 with apredetermined curvature. The internal angle θ8 between virtual linesegments extending from the second and fifth inner surfaces 12 and 15 orbetween virtual line segments extending from the second and sixth innersurfaces 12 and 16 may be in the range of 110° to 160°. The curvaturesof the curved surfaces R3 and R4 may be less than the curvatures of thecurved surfaces R1 and R2, and greater than the curvatures of the curvedsurface R5 and R6.

The inflection point between the third and fifth inner surfaces 13 and15 of the cavity 101 and the inflection point between the fourth andsixth inner surface surfaces 14 and 16 of the cavity 101 may be formedon the first lead frame 121 adjacent to the gap part 115.

In this case, the curved surfaces R1 to R6 may represent the contourline making contact with the bottom surface of the cavity 101, may becentral portions of the corners, or may represent the contour linemaking contact with the top surface of the body 111.

FIG. 16 is a plan view showing the modification of the light emittingdevice of FIG. 15. In the following description referring to FIG. 16,the same parts as those of the first second embodiments will make areference to the first and second embodiments.

Referring to FIG. 16, in the light emitting device, the corners betweenthe third and fifth inner surfaces 13 and 15 of the cavity 101 and thecorners between the fourth and sixth inner surfaces 14 and 16 of thecavity 101 serve as inflection points R11 and R12, respectively, or maybe curved or angulated. The internal angles θ61 between the third andfifth inner surfaces 13 and 15 of the cavity 101, and between the fourthinner surfaces 14 and the sixth inner surfaces 16 of the cavity 101 maybe in the range of 120° to 165°.

The inflection points between the third and fifth inner surfaces 13 and15 of the cavity 101 and between the fourth and sixth inner surfaces 14and 16 may be formed in the contact regions of the first lead frame 121and the gap part 115.

FIG. 17 is a plan view showing the modification of the light emittingdevice of FIG. 15. In the following description referring to FIG. 17,the same parts as those of the first second embodiments will make areference to the first and second embodiments.

Referring to FIG. 17, in the light emitting device, the corners betweenthe third and fifth inner surfaces 13 and 15 of the cavity 101 and thecorners between the fourth and sixth inner surfaces 14 and 16 of thecavity 101 serve as inflection points R13 and R14, respectively, or maybe curved or angulated. The internal angles θ62 between the third andfifth inner surfaces 13 and 15 of the cavity 101, and between the fourthinner surfaces 14 and the sixth inner surfaces 16 of the cavity may bein the range of 120° to 165°.

The inflection point R13 between the third and fifth inner surfaces 13and 15 of the cavity 101, and the inflection point R14 between thefourth and sixth inner surfaces 14 and 16 may be disposed between thegap part 115 between the first and second lead frames 121 and 131. Theinflection points R13 and R14 are spaced apart from a horizontal linesegment to the second lateral side part 12 of the body 111 by apredetermined distance A22, and the distance A22 may be longer than thatof the second lead frame 131. Alternatively, the inflection points R13and R14 are disposed on the second lead frame 131 adjacent to the gappart 115, or may be formed at the boundary part between the gap part 115and the second lead frame 131.

As shown in FIGS. 16 and 17, according to the embodiment, the innersurfaces 15 and 16 connected between the second inner surface 12 of thecavity 101 and the third and fourth inner surfaces 13 and 14 may bedisposed in the form of one or plural flat surfaces or curved surfaces,and may partially have straight line sections.

FIG. 18 is a plan view showing a light emitting device according to thethird embodiment. In the following description of the third embodiment,the same parts as those of the first embodiment will make a reference tothe first embodiment.

Referring to FIG. 18, in the light emitting device, inner surfaces 15Aand 16A connecting the second inner surface 12 of the cavity 101 and thethird and fourth inner surfaces 13 and 14 may include only curvedsurfaces R15 and R16 having a predetermined curvature without straightline sections.

FIG. 19 is a plan view showing a light emitting device according to thefourth embodiment. In the following description of the fourthembodiment, the same parts as those of the first embodiment will make areference to the first embodiment.

Referring to FIG. 19, the light emitting device includes a plurality ofinner surfaces 21 to 28 at the cavity 101 of the body 111, and at leasttwo inner surfaces among the inner surfaces 21 to 28 correspond to onelateral side 171A of the light emitting chip 171.

The inner surfaces 21 to 28 of the cavity 101 include the first andsecond inner surfaces 21 and 22 disposed in opposition to each other,the third and fourth inner surfaces 23 and 24 adjacent to the firstinner surface 21 while being disposed in opposition to each other, andthe fifth and sixth inner surfaces 25 and 26 having the multi-bendingstructure between the third and second inner surfaces 23 and 22, and theseventh and eight inner surfaces 27 and 28 having the multi-bendingstructure between the fourth and second inner surfaces 24 and 22.

The bending angles θ9, θ10, and θ11 from the third inner surface 23 tothe fourth inner surface 24 to the second inner surface 22 may be equalto each other or different from each other. Each of the bending anglesθ9, θ10, and θ11 may be in the range of 100° to 170°.

In addition, the lengths E3 and E4 of the fifth inner surface 25 or theseventh inner surface 24 and the sixth inner surface 26 or the eighthinner surface 28 may be equal to each other or different from eachother. The length E4 of the seven inner surface 27 or the eighth innersurface 28 may be longer than the length E3 of the fifth inner surface25 or the sixth inner surface 26, but the embodiment is not limitedthereto. In addition, the corners between the inner surfaces 21 to 28 ofthe cavity 101 may have a curved surface or an angular surface, but theembodiment is not limited thereto.

FIG. 20 is a plan view showing a light emitting device according to thefifth embodiment. In the following description of the fifth embodiment,the same parts as those of the first embodiment will make a reference tothe first embodiment.

Referring to FIG. 20, in the light emitting device, at least one innersurface among the inner surfaces 31 to 37 of the cavity 101 of the body111 has a surface convex toward the central of the cavity 101. Forexample, the first and second inner surfaces 31 and 32 are disposed inopposition to each other, and the third and fourth inner surfaces 33 and34 are disposed in opposition to each other. The fifth inner surface 35having a curved surface 17 convex toward the center of the cavity 101 isdisposed between the third and second inner surfaces 33 and 32. Thesixth inner surface 35 having a curved surface R18 convex toward thecenter of the cavity 101 is disposed between the fourth and second innersurfaces 34 and 32. The fifth and sixth inner surfaces 35 and 36 may beinclined with respect to the thickness direction of the body 111, orperpendicular to the thickness direction of the body 111, but theembodiment is not limited thereto.

The fifth and sixth inner surfaces 35 and 35 of the cavity 101 protrudein the convex shape toward the center of the cavity 101, so that thewidth D21 of the second inner surface 32 of the cavity 101 may be longerthan that of the first embodiment. Therefore, the space in which theprotective chip 173 may be mounted can be effectively ensured. Theinterval between the fifth and sixth inner surfaces 35 and 36 isgradually reduced, so that the light emitted from the light emittingchip 171 can be effectively reflected.

FIG. 20 is a plan view showing a light emitting device according to thefifth embodiment. The structure of the cavity 101 of the light emittingdevice shown in FIG. 21 may include one of the structures of the firstto fourth embodiments, and the same parts will make reference to thedescription of the structure according to the embodiment.

Referring to FIG. 21, a phosphor substance layer 181 is disposed on thelight emitting chip 171. The molding member 161 may not include aphosphor substance layer, or a phosphor substance different from thephosphor substance contained in the phosphor substance layer 181.

The phosphor substance layer 181 may have an area smaller than the areaof the top surface of the light emitting chip 171. The phosphorsubstance layer 181 may be formed on the top surface and the lateralside of the light emitting chip 171, but the embodiment is no limitedthereto. The phosphor substance layer 181 may include at least one ofblue, red, yellow, and green color phosphor substances.

In addition, in the second lead frame 131, the fourth recess part 133may be further formed at a region corresponding to the gap part 115, butthe embodiment is not limited thereto. In addition, the center of thelight emitting chip 171 may deviate from the central axis Z0 of thelight emitting device.

FIG. 22 is a plan view showing a light emitting device according to thesixth embodiment. The structure of the cavity 101 of the light emittingdevice shown in FIG. 22 may include one of the structures of the firstto fourth embodiments, and the same parts will make reference to thedescription of the structure according to the embodiment.

Referring to FIG. 22, in the light emitting device, the light emittingchip 171 is disposed on at least one of the first and second lead frames121 and 131, and the light emitting chip 171 is disposed in the cavity101.

The cavity 101 includes a first molding member 161A having a heightlower than that of the top surface of the light emitting chip 171, and asecond molding member 161B disposed on the light emitting chip 171 andthe first molding member 161A. The first and second molding members 161Aand 161B may include metallic oxides. For example, the metallic oxidesof the first and second molding members 161A and 161B may be identicalto each other or different from each other.

The first molding member 161A includes the first metallic oxide, and thesecond molding member 161B includes a second metallic oxide. The firstmetallic oxide includes one of SiO₂, SiO_(x), SiO_(x)N_(y), Si₃N₄,Al₂O₃, and TiO₂, and the second metallic oxide includes one of SiO₂,SiO_(x), SiO_(x)N_(y), Si₃N₄, Al₂O₃, and TiO₂.

In addition, 7.5 wt % to 12.5 wt % of the first metallic oxide may becontained in the first molding member 161A. Accordingly, the firstmolding member 161A acts as a reflective layer disposed around the lightemitting chip 171. The first molding member 161A acts as the reflectivelayer to compensate for the irregular distribution of the orientationangles of light emitted from the cavity 101 having the asymmetricstructure disclosed in the embodiment.

In addition, 7.5 wt % to 12.5 wt % of the first metallic oxide may becontained in the second molding member 161B. Accordingly, the secondmolding member 161B may act as a diffusion layer on the light emittingchip 171. FIG. 27 is a graph showing the distribution of orientationangles when the first molding member 16A representing reflectance is notdisposed in the cavity of the light emitting device, and FIG. 28 is agraph showing the distribution of orientation angles when the firstmolding member 16A representing reflectance is disposed in the cavity ofthe light emitting device. As shown in the comparison between FIGS. 27and 28, the difference in the orientation angles between the first axisY-Y of FIG. 1 and the second axis X-X of FIG. 1 at the side region Z1may be reduced 2° or less.

Although not shown in drawings, the phosphor substance layer isinterposed between the light emitting chip 171 and the second moldingmember 161B as shown in FIG. 21, or the phosphor substance may becontained in the second molding member.

FIG. 23 is a side sectional view showing the light emitting deviceaccording to the seventh embodiment. The structure of the cavity 101 inthe light emitting device of FIG. 23 may include one of structuresaccording to the first to fourth embodiments, and the same parts willmake reference to that of the embodiment.

Referring to FIG. 23, in the light emitting device, the bottom surfaceof the cavity 101 in the body 111 may be a flat surface classified intoa region disposed therein with the light emitting chip 171 and a regionwithout the light emitting chip 171. For example, the top surface of thefirst lead frame 121 having the light emitting chip 171 mounted thereonis not aligned in line with the top surface of the second lead frame 131separated from the light emitting chip 171. According to the embodiment,the top surface of the second lead frame 131 is disposed higher than thetop surface of the first lead frame 121 by a predetermined differenceG2, and the first and second lead frames 121 and 131 are supported byusing the gap part 115 between the first and second lead frames 121 and131.

The height difference G2 between the top surface of the second leadframe 131 and the top surface of the first lead frame 121 is 50% or lessof the thickness T2 of the first lead frame 121, for example, 10% to 50%of the thickness T2 of the first lead frame 121.

The second lead frame 131 includes a bonding part 125B disposed on thebottom surface of the cavity and a lead region 135A disposed on thebottom surface of the body. The lead region 135A may be disposed so thatthe lead region 135A may be bent from the bonding part 125B.

The gap part 115A between the first and second lead frames 121 and 131has an inclined surface 115B corresponding to the light emitting chip171. The inclined surface 115B can effectively reflect the light emittedfrom the light emitting chip 171. The height H2 of the cavity 101 at thesecond inner surface 12 may be lower than the height H1 of the cavity101 in the first inner surface 11. The phosphor substance layer 181 maybe disposed on the light emitting chip 171.

The phosphor substance layer 181 may be disposed on the top surface ofthe light emitting chip 171 or the top and lateral surfaces of the lightemitting chip 171, but the embodiment is not limited thereto.

FIGS. 24 to 26 are views showing the light emitting device according tothe eighth embodiment. FIG. 24 is a plan view showing the light emittingdevice, and FIG. 25 is a sectional view taken along lien E-E of thelight emitting device of FIG. 24. FIG. 26 is a sectional view takenalong line F-F of the light emitting device of FIG. 24. In the followingdescription of the eighth embodiment, the same components as those ofthe above embodiment will make reference to the embodiments.

Referring to FIGS. 24 to 26, the light emitting device 200 includes abody 211 having a cavity 201, a plurality of lead frames 221 and 231, alight emitting chip 271, a wire 275, and a molding member 261.

The body 211 includes the first to fourth lateral side parts 61 to 64serving as outer surfaces, and the cavity 201 of the body 211 includes aplurality of inner surfaces 41, 42, 43, and 44. The corners between theinner surfaces 41 to 44 are curved or angulated, but the embodiment isnot limited thereto.

The body 211 includes a support body 212 coupled with the first andsecond lead frames 221 and 231, and a reflection body 213 disposed onthe first and second lead frames 221 and 231.

The first lead frame 211 extends to the lower portions of the first andsecond inner surfaces 41 to 44 of the cavity 201, and the second leadframe 331 extends to the lower portions of the second and fourth innersurfaces 42 and 44.

The first lead frame 211 includes first and second recess parts 222 and223 forming the step structure from the first lead region 225 which isdisposed at the lower portion of the first lead frame 211. Thedescription of the structures of the first lead region 225 and the firstand second recess parts 222 and 223 will make reference to thedescription of the first embodiment.

The first lead frame 211 includes a first bonding part 226 having thelight emitting chip disposed therein and a second bonding part 227extending to the lower portion of the second inner surface 32 of thecavity 201. The protective chip 272 is disposed on the second bondingpart 227.

The second bonding part 227 has a step structure from the first bondingpart 226. Regarding the depth of the cavity 201, the height H2 of thecavity 201 on the top surface of the second bonding part 227 may belower than the depth H1 of the cavity 201 on the top surface of thefirst bonding part 226.

As shown in FIG. 26, the thickness T6 of the second bonding part 227 maybe 50% or more of the thickness T2 of the first lead frame 221.

The second lead frame 231 includes a third bonding part 233 disposed onthe bottom surface of the cavity 201, a second lead region 236 exposedto the bottom surface of the body 211, and a connection part 234connecting the third bonding part 233 to the second lead region 236. Thewidth D3 of the third bonding part 233 may be wider than the width D4 ofthe second bonding part 227.

As shown in FIG. 25, the gap part 215 is interposed between the firstand second lead frames 221 and 231, and a portion of the gap part 215may protrude beyond the first bonding part 226. Accordingly, the gappart 215 has an inclined surface 215A with respect to one lateral sideof the light emitting chip 271 to reflect the light incident from thelight emitting chip 271.

As shown in FIG. 26, the bending surface 226A between the first andsecond bonding parts 226 and 227 is inclined, and corresponds to thelateral side of the light emitting chip 271.

The light emitting chip 271 is connected to the third bonding part 233of the second lead frame 231 through the wire 275. The protective chip273 may be connected to the third bonding part 233 of the second leadframe 231 through the wire 276.

FIG. 29 is a side sectional view showing one example of the lightemitting chip according to the embodiment.

Referring to FIG. 29, the light emitting chip includes a substrate 311,a buffer layer 312, a light emitting structure 310, a first electrode316, and a second electrode 317. The substrate 311 may include asubstrate including a transmissive material or a non-transmissivematerial, and may include a conductive substrate or an insulatingsubstrate.

The buffer layer 312 reduces the lattice constant difference between thematerials constituting the substrate 311 and the light emittingstructure 310, and may include a nitride semiconductor. A nitridesemiconductor layer, which is not doped with dopants, is furtherdisposed between the buffer layer 312 and the light emitting structure310, so that the crystal quality can be improved.

The light emitting structure 310 includes a first conductivesemiconductor layer 313, an active layer 314, and a second conductivesemiconductor layer 315.

The first conductive semiconductor layer 313 may include the group III-Vcompound semiconductor doped with the first conductive dopant. Forexample, the first conductive semiconductor layer 313 may include thesemiconductor material having the compositional formula ofIn_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1). In detail, the firstconductive semiconductor layer 313 may include the stack structure oflayers including one selected from the group consisting of GaN, InN,AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, andAlGaInP. If the first conductive semiconductor layer 313 is an n typesemiconductor layer, the first conductive dopant includes the n typedopant such as Si, Ge, Sn, Se, or Te.

A first clad layer may be formed between the first conductivesemiconductor layer 313 and the active layer 314. The first clad layermay include a GaN-based semiconductor, and the bandgap of the first cladlayer may be equal to or greater than the bandgap of the active layer314. The first clad layer has the first conductive type, and confinescarriers.

The active layer 314 is disposed on the first conductive semiconductorlayer 313, and includes a single quantum well structure, a multiplequantum well (MQW) structure, a quantum wire structure or a quantum dotstructure. The active layer 314 has the cycle of the well and barrierlayers. The well layer may have the composition formula ofIn_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1), and the barrier layermay have the composition formula of In_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1,0≦y≦1, 0≦x+y≦1). At least one cycle of the well/barrier layers may beused through the stack structure of InGaN/GaN, GaN/AlGaN, InGaN/AlGaN,InGaN/InGaN, InAlGaN/AlGaN and InAlGaN/InAlGaN. The barrier layer mayinclude a semiconductor material having the bandgap higher than thebandgap of the well layer.

The second conductive layer 315 is formed on the active layer 314. Thesecond conductive layer 315 includes a semiconductor doped with secondconductive dopants, for example, includes a semiconductor having thecomposition formula of In_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1).In detail, the second conductive semiconductor layer 315 may include oneselected from compound semiconductors such as GaN, InN, AlN, InGaN,AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. If thesecond conductive semiconductor layer 315 is a p type semiconductorlayer, the semiconductor conductive dopant includes the p type dopantsuch as Mg, Zn, Ca, Sr, or Ba.

The second conductive semiconductor layer 315 may include a superlatticestructure, and the superlattice structure may include an InGaN/GaNsuperlattice structure or am AlGaN/GaN superlattice structure. Thesuperlattice structure of the second conductive semiconductor layer 315abnormally spreads the current, thereby protecting the active layer 314.

In addition, the light emitting structure 310 may have an oppositeconductive type. For example, the first conductive semiconductor layer313 may include a P type semiconductor layer, and the second conductivesemiconductor layer 315 may include an N type semiconductor layer. Thesecond conductive semiconductor layer 315 may be disposed thereon with afirst conductive semiconductor layer having the polarity opposite to thesecond conductive type polarity.

The light emitting structure 310 may be realized by using one of an n-pjunction structure, a p-n junction structure, an n-p-n junctionstructure, and a p-n-p junction structure. The “p” represents a p typesemiconductor, the “n” represents an n type semiconductor layer, and the“-” represents that the p type semiconductor is directly or indirectlyconnected to the n type semiconductor. Hereinafter, a case that theuppermost layer of the light emitting structure 310 is the secondconductive semiconductor layer 315 will be described for the convenienceof explanation.

The first electrode 316 is disposed on the first conductivesemiconductor layer 313, and the second electrode 317 having a currentspreading layer is disposed on the second conductive semiconductor layer315. The first and second electrodes 316 and 317 are connected to eachother through a wire, or through another connection scheme.

FIG. 28 is a graph showing another example of the light emitting chipaccording to the embodiment. Hereinafter, in the following descriptionof the embodiment, the details of the same parts as that of FIG. 27 willbe omitted except for brief description.

Referring to FIG. 28, in a light emitting chip according to theembodiment, a contact layer 321 is formed under a light emittingstructure 310, a reflective layer 324 is formed under the contact layer321, a support member 325 is formed under the reflective layer 324, anda protective layer 323 may be formed around the reflective layer 324 andthe light emitting structure 310.

One or a plurality of first electrodes 316 may be formed on the lightemitting structure 310, and the first electrode 316 includes a padbonded to a wire.

The light emitting chip may be formed by removing a growth substrateafter forming a contact layer 321, a protective layer 323, a reflectivelayer 324, and a support member 323 under the second conductivesemiconductor layer 315.

The contact layer 321 may make ohmic-contact with a lower layer of thelight emitting structure 310, for example, the second conductivesemiconductor layer 315, and may include a metallic oxide, a metallicnitride, an insulating material, or a conductive material. For example,the contact layer 321 may include ITO (indium tin oxide), IZO (indiumzinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zincoxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tinoxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO(gallium zinc oxide), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf,and the selective combination thereof. The contact layer 321 may beformed in a multi-layer structure by using a metallic material and atransparent material such as IZO, IZTO, IAZO, IGZO, IGTO, AZO, or ATO.For example, the contact layer 321 may have the stack structure ofIZO/Ni, AZO/Ag, IZO/Ag/Ni, or AZO/Ag/Ni. A layer to block current may befurther formed in the contact layer 321 corresponding to the electrode316.

The protective layer 323 may include a metallic oxide or an insulatingmaterial. For example, the protective layer 323 may selectively includeITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tinoxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zincoxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO(antimony tin oxide), GZO (gallium zinc oxide), SiO₂, SiO_(x),SiO_(x)N_(y), Si₃N₄, Al₂O₃, or TiO₂. The protective layer 323 may beformed through a sputtering scheme or a deposition scheme. The metalconstituting the reflective layer 324 may prevent the layers of thelight emitting structure 310 from being shorted.

The reflective layer 324 may include metal such as Ag, Ni, Al, Rh, Pd,Ir, Ru, Mg, Zn, Pt, Au, Hf, or the selective combination thereof. Thereflective layer 324 may have a width greater than the width of thelight emitting structure 310, thereby improving the light reflectionefficiency. A metallic layer for bonding and a metallic layer forthermal diffusion may be further disposed between the reflective layer324 and the support member 325, but the embodiment is not limitedthereto.

The support member 325 serves as a base substrate, and may include metalsuch as Cu, Au, Ni, Mo, or Cu—W, and a carrier wafer, such as Si, Ge,GaAs, ZnO, and SiC. An adhesive layer may be further formed between thesupport member 325 and the reflective layer 324, and bonds the twolayers to each other. The disclosed light emitting chip is four theillustrative purpose, and the embodiment is not limited thereto. Thelight emitting chip may be selective applied to the light emittingdevice according to the embodiment, but the embodiment is not limitedthereto.

<Lighting System>

The light emitting device according to the embodiment is applicable to alighting system. The lighting system includes a structure in which aplurality of light emitting devices are arrayed. The lighting systemincludes a display apparatus shown in FIGS. 31 and 32, a lightingapparatus shown in FIG. 33, a lighting lamp, a camera flash, a signallamp, a headlamp for a vehicle, and an electronic display.

FIG. 31 is an exploded perspective view showing a display apparatushaving the light emitting device according to the embodiment.

Referring to FIG. 31, a display apparatus 1000 according to theembodiment includes a light guide plate 1041, a light source module 1031to supply light to the light guide plate 1041, a reflective member 1022under the light guide plate 1041, an optical sheet 1051 on the lightguide plate 1041, a display panel 1061 on the optical sheet 1051, and abottom cover 1011 to receive the light guide plate 1041, the lightsource module 1031, and the reflective member 1022, but the embodimentis not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate1041, the optical sheet 1051, and the light unit 1050 may be defined asa light unit 1050.

The light guide plate 1041 diffuses the light supplied from the lightsource module 1031 to provide surface light. The light guide plate 1041may include a transparent material. For example, the light guide plate1041 may include one of acryl-based resin, such as PMMA (polymethylmethacrylate, PET (polyethylene terephthalate), PC (polycarbonate), COC(cyclic olefin copolymer) and PEN (polyethylene naphthalate) resin.

The light source module 1031 is disposed on at least one side of thelight guide plate 1041 to supply the light to at least one side of thelight guide plate 1041. The light source module 1031 serves as the lightsource of the display device.

At least one light source module 1031 is disposed to directly orindirectly supply the light from one side of the light guide plate 1041.The light source module 1031 may include a substrate 1033 and the lightemitting device according to the embodiments or the light emittingdevice 1035. The light emitting device or the light emitting device 1035are arranged on the substrate 1033 while being spaced apart from eachother at the predetermined interval.

The substrate 1033 may include a printed circuit board (PCB) including acircuit pattern (not shown). In addition, the substrate 1033 may alsoinclude a metal core PCB (MCPCB) or a flexible PCB (FPCB) as well as atypical PCB, but the embodiment is not limited thereto. If the lightemitting device 1035 is installed on the side of the bottom cover 1011or on a heat dissipation plate, the substrate 1033 may be omitted. Theheat dissipation plate partially makes contact with the top surface ofthe bottom cover 1011.

In addition, the light emitting device 1035 are arranged such that lightexit surfaces to discharge light of the light emitting device 1035 arespaced apart from the light guide plate 1041 by a predetermined distanceon the substrate 1033, but the embodiment is not limited thereto. Thelight emitting device 1035 may directly or indirectly supply the lightto a light incident surface, which is one side of the light guide plate1041, but the embodiment is not limited thereto.

The reflective member 1022 is disposed below the light guide plate 1041.The reflective member 1022 reflects the light, which is traveleddownward through the bottom surface of the light guide plate 1041,toward the display panel 1061, thereby improving the brightness of thelight unit 1050. For example, the reflective member 1022 may includePET, PC or PVC resin, but the embodiment is not limited thereto. Thereflective member 1022 may serve as the top surface of the bottom cover1011, but the embodiment is not limited thereto.

The bottom cover 1011 may receive the light guide plate 1041, the lightsource module 1031, and the reflective member 1022 therein. To this end,the bottom cover 1011 has a receiving section 1012 having a box shapewith an opened top surface, but the embodiment is not limited thereto.The bottom cover 1011 can be coupled with the top cover (not shown), butthe embodiment is not limited thereto.

The bottom cover 1011 can be manufactured through a press process or anextrusion process by using metallic material or resin material. Inaddition, the bottom cover 1011 may include metal or non-metallicmaterial having superior thermal conductivity, but the embodiment is notlimited thereto.

The display panel 1061, for example, is an LCD panel including first andsecond transparent substrates, which are opposite to each other, and aliquid crystal layer interposed between the first and second substrates.A polarizing plate can be attached to at least one surface of thedisplay panel 1061, but the embodiment is not limited thereto. Thedisplay panel 1061 displays information by allowing the light to passtherethrough. The display device 1000 can be applied to various portableterminals, monitors of notebook computers, monitors or laptop computers,and televisions.

The optical sheet 1051 is disposed between the display panel 1061 andthe light guide plate 1041 and includes at least one transmissive sheet.For example, the optical sheet 1051 includes at least one selected fromthe group consisting of a diffusion sheet, a horizontal and verticalprism sheet, and a brightness enhanced sheet. The diffusion sheetdiffuses the incident light, the horizontal and vertical prism sheetconcentrates the incident light onto the display panel 1061, and thebrightness enhanced sheet improves the brightness by reusing the lostlight. In addition, a protective sheet can be disposed on the displaypanel 1061, but the embodiment is not limited thereto.

The light guide plate 1041 and the optical sheet 1051 can be disposed inthe light path of the light source module 1031 as optical members, butthe embodiment is not limited thereto.

FIG. 32 is a sectional view showing a display apparatus according to theembodiment.

Referring to FIG. 32, the display device 1100 includes a bottom cover1152, a substrate 1120 on which the light emitting device 1124 arearrayed, an optical member 1154, and a display panel 1155.

The substrate 1120 and the light emitting device 1124 may constitute thelight source module 1160. In addition, the bottom cover 1152, at leastone light source module 1160, and the optical member 1154 may constitutethe light unit. The bottom cover 1151 can be disposed with a receivingsection 1153, but the embodiment is not limited thereto. The lightsource module 1160 includes a substrate 1120, and a plurality of lightemitting devices arranged on the substrate 1120 or a light emittingdevice 1124.

The optical member 1154 may include at least one selected from the groupconsisting of a lens, a light guide plate, a diffusion sheet, ahorizontal and vertical prism sheet, and a brightness enhanced sheet.The light guide plate may include PC or PMMA (Poly methyl methacrylate).The light guide plate can be omitted. The diffusion sheet diffuses theincident light, the horizontal and vertical prism sheet concentrates theincident light onto a display region, and the brightness enhanced sheetimproves the brightness by reusing the lost light.

The optical member 1154 is disposed above the light source module 1160in order to convert the light emitted from the light source module 1160into the surface light.

FIG. 33 is an exploded perspective view showing a lighting device havingthe light emitting device according to the embodiment.

Referring to FIG. 33, the lighting device according to the embodimentmay include a cover 2100, a light source module 2200, a heat radiationmember 2400, a power supply part 2600, an inner case 2700, and a socket2800. In addition, the light emitting device according to the embodimentmay further include at least one of a member 2300 and a holder 2500. Thelight source module 2200 may include the light emitting device accordingto the embodiment.

For example, the cover 2100 has the shape of a bulb, or a hemisphericalshape. The cover 2100 may have a hollow structure, and a portion of thecover 2100 may be open. The cover 2100 may be optically connected to thelight source module 2200, and may be coupled with the heat radiationmember 2400. The cover 2100 may have a recess part coupled with the heatradiation member 2400.

The inner surface of the cover 2100 may be coated with ivory whitepigments serving as a diffusing agent. The light emitted from the lightsource module 2200 may be scattered or diffused by using the ivory whitematerial, so that the light can be discharged to the outside.

The cover 2100 may include glass, plastic, PP, PE, or PC. In this case,the PC represents superior light resistance, superior heat resistance,and superior strength. The cover 2100 may be transparent so that thelight source module 2200 may be recognized at the outside. In addition,the cover 2100 may be opaque. The cover 2100 may be formed through ablow molding scheme.

The light source module 2200 may be disposed at one surface of the heatradiation member 2400. Accordingly, the heat emitted from the lightsource module 2200 is conducted to the heat radiation member 2400. Thelight source module 2200 may include a light emitting device 2210, aconnection plate 2230, and a connector 2250.

The member 2300 is disposed on the top surface of the heat radiationmember 2400, and has a guide groove 2310 having a plurality of lightemitting devices 2210 and a connector 2250 inserted into the guidegroove 2310. The guide groove 2310 corresponds to the substrate of thelight emitting device 2210 and the connector 2250.

White pigments may be applied to or coated on the surface of the member2300. The member 2300 reflects light, which reflected by the innersurface of the cover 2100 to return to the light source module 2200,toward the cover 2100. Accordingly, the light efficiency of the lightingapparatus according to the embodiment can be improved.

The member 2300 may include an insulating material. The connection plate2230 of the light source module 2200 may include an electric-conductivematerial. Accordingly, the heat radiation member 2400 may beelectrically connected to the connection plate 2230. The member 2300includes an insulating material to prevent the electrical short betweenthe connection plate 2230 and the heat radiation member 2400. The heatradiation member 2400 receives heat from the light source module 2200and the heat from the power supply part 2600 and radiates the heats.

The holder 2500 blocks a receiving groove 2719 of an insulating part2710 disposed in an internal case 2700. Accordingly, the power supplypart 2600 received in the insulating part 2710 of the internal case 2700is sealed. The holder 2500 has a guide protrusion part 2510. The guideprotrusion part 2510 may include a hole allowing a protrusion part 2610of the power supply part 2600 to pass therethrough.

The power supply part 2600 processes and transforms an electrical signalreceived from the outside and supplies the electrical signal to thelight source module 2200. The power supply part 2600 is received in thereceiving groove 2719 of the internal case 2700, and sealed in theinternal case 2700 by the holder 2500.

The power supply part 2600 may include a protrusion part 2610, a guidepart 2630, a base 2650, and an extension part 2670.

The guide part 2630 protrudes outward from one side of the base 2650.The guide part 2630 may be inserted into the holder 2500. A plurality ofparts may be disposed on one surface of the base 250. For example, theparts include a DC converter, a driving chip to drive the light sourcemodule 220, and an ESD (electrostatic discharge) protective device toprotect the light source module 2200, but the embodiment is not limitedthereto.

The extension part 2670 protrudes outward from another side of the base2650. The extension part 2670 is inserted into the connection part 2750of the internal case 2700, and receives an electrical signal from theoutside. For example, the extension part 2670 may be equal to or lessthan the width of the connection part 2750 of the internal case 2700.The extension part 2670 may be electrically connected to the socket 2800through a wire.

The internal case 2700 may be disposed therein with a molding parttogether with the power supply part 2600. The molding part is formed byhardening a molding liquid, so that the power supply part 2600 may befixed into the internal case 2700.

The embodiment can provide a general-purpose light emitting devicehaving lead regions spaced apart from each other so that the lightemitting device is mounted on the substrate. The embodiment can providea light emitting device capable of representing improved heat radiationefficiency. According to the embodiment, the lower region between thelead frames can be effectively supported. The embodiment can provide acavity of a light emitting device in an asymmetric structure.

According to the embodiment, the interval between inner parts of thecavity of the light emitting device is gradually reduced, so that thedistribution of orientation angles can be improved in the cavity havingthe asymmetric structure. According to the embodiment, the lightefficiency in the cavity of the light emitting device can be improved,so that the reliability can be improved. The embodiment can provide thelight emitting device capable of reducing light loss caused by theinterval between the inner surface of the cavity farther away from thelight emitting chip and the light emitting chip if the light emittingchip having a large area is mounted.

The embodiment can reduce the difference between light orientationangles at different axes of the light emitting device. The embodimentcan provide a light emitting device having a cavity in the asymmetricstructure and used for the general purpose. The embodiment can improvethe reliability of the light emitting device and the lighting systemhaving the same.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting device comprising: a bodyincluding first and second lateral side parts corresponding to eachother, third and fourth lateral side parts corresponding to each other,and a cavity having an open upper portion; a first lead frame disposedon a bottom surface of the cavity while extending in a direction of thefirst lateral side part of the body; a second lead frame disposed on thebottom surface of the cavity while extending in a direction of thesecond lateral side part of the body; a gap part disposed on the bottomsurface of the cavity and disposed between the first and second leadframes; a light emitting chip disposed on the first lead frame in thecavity; and a molding member in the cavity, wherein the first lead frameincludes a first recess part recessed at a first depth in the directionof the first lateral side part of the body from the gap part and asecond recess part recessed at a second depth in a region adjacent tothe first lateral side part of the body, the first depth of the firstrecess part is different from the second depth of the second recesspart, wherein the first recess part is overlapped with the lightemitting chip in a vertical direction, wherein the first lead framefurther includes plurality of first protrusions exposed to the firstlateral side part of the body, second protrusion exposed to the thirdlateral side part of the body, and third protrusion exposed to thefourth lateral side part of the body, wherein the first lead frameincludes a first region adjacent to the gap part on the first recesspart and a second region adjacent to the first lateral side part, thefirst region has a thickness thinner than a thickness of the secondregion and is overlapped with the first recess part, and the second andthird protrusions protrude from the first region adjacent to the gappart, wherein the body includes a reflective insulating material,wherein the molding member includes a transmissive resin material,wherein the cavity is recessed from a top surface of the body, whereinthe cavity includes a first inner surface which faces a first lateralside of the light emitting chip, a second inner surface which faces thefirst inner surface, a third inner surface extended from the first innersurface, a fourth inner surface extended from the first inner surfaceand which faces the third inner surface, a fifth inner surface disposedbetween the second and third inner surfaces, and a sixth inner surfacedisposed between the second and fourth inner surfaces, wherein thefirst, second, third, fourth, fifth and sixth inner surfaces of thecavity contact the molding member, wherein the second inner surface hasa second width narrower than a first width of the first inner surface,wherein the second width is wider than a width of the first lateral sideof the light emitting chip, wherein a width of the fifth inner surfaceis smaller than the first width and wider than the second width, andwherein an internal angle between the fifth inner surface and the secondinner surface is an obtuse angle.
 2. The light emitting device of claim1, wherein the first depth of the first recess part is two times greaterthan the second depth of the second recess part, or the first depth isin a range of 30% to 60% of a length of the first lead frame.
 3. Thelight emitting device of claim 1, wherein the gap part extends into thefirst recess part, and a width of a bottom surface of the gap part istwo times wider than a width of a top surface of the gap part.
 4. Thelight emitting device of claim 1, wherein the first recess part has awidth equal to an interval between the third and fourth lateral sideparts of the body, and wherein an area of a bottom surface of the firstlead frame is narrower than an area of a top surface of the first leadframe by 30% or more of the area of the top surface of the first leadframe.
 5. The light emitting device of claim 1, wherein the first leadframe further includes a first lead region interposed between the firstand second recess parts and exposed to a bottom surface of the body, andthe second lead frame includes a second lead region adjacent to the gappart and exposed to the bottom surface of the body.
 6. The lightemitting device of claim 5, wherein the second lead frame furtherincludes a third recess part disposed at a region adjacent to the secondlateral side part of the body and disposed at a third depth in adirection of the gap part, and the second depth of the second recesspart is equal to the third depth of the third recess part.
 7. The lightemitting device of claim 1, wherein the second lead frame includesplurality of fourth protrusions exposed to the second lateral side partof the body, fifth protrusion exposed to the third lateral side part ofthe body, and sixth protrusion exposed to the fourth lateral side partof the body, and wherein the first protrusions of the first lead frameand the fourth protrusions of the second lead frame are spaced apartfrom a bottom surface of the body, wherein the second protrusion exposedto the third lateral side part of the body has a width wider than awidth of the fifth protrusion exposed to the third lateral side part ofthe body, wherein the fourth protrusions of the second lead frame arespaced apart from each other and a portion of the body is disposedbetween the fourth protrusions, and wherein a bottom surface of each ofthe fourth protrusions is a curved surface and contacts the body.
 8. Alight emitting device comprising: a body including first and secondlateral side parts corresponding to each other, third and fourth lateralside parts corresponding to each other, and a cavity having an openupper portion; a first lead frame disposed on a bottom surface of thecavity while extending in a direction of the first lateral side part ofthe body; a second lead frame disposed on the bottom surface of thecavity while extending in a direction of the second lateral side part ofthe body; a gap part disposed on the bottom surface of the cavity anddisposed between the first and second lead frames; a light emitting chipdisposed on the first lead frame in the cavity; and a molding member inthe cavity, wherein the first lead frame includes a first recess partrecessed at a first depth in the direction of the first lateral sidepart of the body from the gap part and a second recess part recessed ata second depth in a region adjacent to the first lateral side part ofthe body, and the first depth of the first recess part is different fromthe second depth of the second recess part, wherein the body includes areflective insulating material, wherein the molding member includes atransmissive resin material, wherein the cavity is recessed from a topsurface of the body, wherein the cavity includes a first inner surfacewhich faces a first lateral side of the light emitting chip, a secondinner surface which faces the first inner surface, a third inner surfaceextended from the first inner surface, a fourth inner surface extendedfrom the first inner surface and which faces the third inner surface, afifth inner surface disposed between the second and third innersurfaces, and a sixth inner surface disposed between the second andfourth inner surfaces, wherein the first, second, third, fourth, fifthand sixth inner surfaces of the cavity contact the molding member,wherein the second inner surface has a second width narrower than afirst width of the first inner surface, wherein the second width iswider than a width of the first lateral side of the light emitting chip,wherein a width of the fifth inner surface is narrower than the firstwidth and wider than the second width, and wherein an internal anglebetween the fifth inner surface and the second inner surface is anobtuse angle, wherein the first recess part is overlapped with the lightemitting chip in a vertical direction, and wherein the first innersurface and the second inner surface are inclined with respect to ahorizontal bottom surface of the body, wherein the first lead framefurther includes plurality of first protrusions exposed to the firstlateral side part of the body, second protrusion exposed to the thirdlateral side part of the body, and third protrusion exposed to thefourth lateral side part of the body, and wherein the first lead frameincludes a first region adjacent to the gap part on the first recesspart and a second region adjacent to the first lateral side part, thefirst region has a thickness thinner than a thickness of the secondregion and is overlapped with the first recess part, and the secondprotrusion and the third protrusion protrude from the first regionadjacent to the gap part.
 9. The light emitting device of claim 8,wherein the second inner surface of the cavity has a width 2.5 times to3.5 times narrower than a width of the first inner surface.
 10. Thelight emitting device of claim 8, wherein the second lead frame includesplurality of fourth protrusions exposed to the second lateral side partof the body, fifth protrusion exposed to the third lateral side parts ofthe body, and sixth protrusion exposed to the fourth lateral side partof the body, and the first protrusions of the first lead frame and thefourth protrusions are spaced apart from a bottom surface of the body,and wherein the second protrusion exposed to the third lateral side partof the body has a width wider than a width of the fifth protrusionexposed to the third lateral side part of the body, wherein the fourthprotrusions of the first lead frame are spaced apart from each other anda portion of the body is disposed between the fourth protrusions, andwherein a bottom surface of each of the fourth protrusions is a curvedsurface and contacts the body.
 11. The light emitting device of claim 8,wherein an internal angle between the fifth inner surface and the thirdinner surface is greater than an internal angle between the fifth innersurface and the second inner surface, and an internal angle between thesixth inner surface and the fourth inner surface is greater than anangle between the sixth inner surface and the second inner surface. 12.A light emitting device comprising: a body including first and secondlateral side parts corresponding to each other, third and fourth lateralside parts corresponding to each other, and a cavity having an openupper portion; a first lead frame disposed on a bottom surface of thecavity while extending in a direction of the first lateral side part ofthe body; a second lead frame disposed on the bottom surface of thecavity while extending in a direction of the second lateral side part ofthe body; a gap part disposed on the bottom surface of the cavity anddisposed between the first and second lead frames; a light emitting chipdisposed on the first lead frame in the cavity; and a molding member inthe cavity, wherein the body includes a reflective insulating material,wherein the molding member includes a transmissive resin material,wherein the cavity is recessed from a top surface of the body, whereinthe cavity includes a first inner surface which faces a first lateralside of the light emitting chip, a second inner surface which faces thefirst inner surface, a third inner surface extended from the first innersurface, a fourth inner surface extended from the first inner surfaceand which faces the third inner surface, a fifth inner surface disposedbetween the second and third inner surfaces, and a sixth inner surfacedisposed between the second and fourth inner surfaces, wherein thesecond inner surface has a second width narrower than a first width ofthe first inner surface, wherein the second width is wider than a widthof the first lateral side of the light emitting chip, wherein a width ofthe fifth inner surface is narrower than the first width and wider thanthe second width, wherein an internal angle between the fifth innersurface and the second inner surface is an obtuse angle, wherein a widthof the sixth inner surface is narrower than the first width and widerthan the second width, wherein the first, second, third, fourth, fifthand sixth inner surfaces of the cavity contact the molding member,wherein the first recess part is overlapped with the light emitting chipin a vertical direction, wherein a portion of the gap part is disposedin the first recess, and wherein the first lead frame further includesplurality of first protrusions exposed to the first lateral side part ofthe body, second protrusion exposed to the third lateral side part ofthe body, and third protrusion exposed to the fourth lateral side partof the body, and wherein the first lead frame includes a first regionadjacent to the gap part on the first recess part and a second regionadjacent to the first lateral side part, the first region has athickness thinner than a thickness of the second region and isoverlapped with the first recess part, and the second protrusion andthird protrusion protrude from the first region adjacent to the gappart, wherein the first protrusions of the first lead frame are spacedapart from each other, wherein bottom surface of each of the firstprotrusions is a curved surface and contact the body, wherein the secondlead frame further includes plurality of fourth protrusions exposed tothe second lateral side part of the body, fifth protrusion exposed tothe third lateral side part of the body, and sixth protrusion exposed tothe fourth lateral side part of the body, wherein the fourth protrusionsof the second lead frame are spaced apart from each other, and wherein abottom surface of each of the fourth protrusions is a curved surface andcontact the body.
 13. The light emitting device of claim 12, furthercomprising a protective chip disposed on the second lead frame anddisposed between the cavity and at least one of the first to fourthlateral side parts of the body, wherein the second inner surface has awidth which is 1.5 times narrower than a width of the first innersurface.
 14. The light emitting device of claim 13, wherein the cavityfurther includes third and fourth inner surfaces connected to the firstinner surface and corresponding to each other at both sides of the lightemitting chip, a fifth inner surface between the second and third innersurfaces, and a sixth inner surface between the second and fourth innersurfaces, and the protective chip is adjacent to at least one of thefifth and sixth inner surfaces of the cavity.
 15. The light emittingdevice of claim 1, wherein the first protrusions are spaced apart fromeach other and a portion of the body is disposed between the firstprotrusions, and wherein bottom surfaces of the first protrusions arecurved surfaces and contact the body.
 16. The light emitting device ofclaim 1, wherein a width of the sixth inner surface is narrower than thefirst width and wider than the second width and an internal anglebetween the fifth inner surface and the second inner surface is anobtuse angle.